Molex (a subsidiary of Koch Industries) long-term goal is to extend customer engagement across all of Molex—from engineering and product development to procurement, supply chain, quality, regional distributor like Abacus Taiwan and China. In the future, customers expect always-on communications, immediate responses to their service requests and expedited problem resolutions.
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Molexʼs Micro Solution product line for IoT is comprised of sensor and gateway. Because the cloud is used in a diverse range of market and application, allowing us to greatly reduce size and weight of sensor.
From Board-to-Board connector 0.35mm - 0.635mm battery series, Antenna, 0.3mm – 0.5mm FPC connector for various market such as Industry automation IoT creation, Factory automation unmanned carrier, medical and healthcare.
Molex FPC connection is a more reliable solution because it eliminate the human error potential of manually wired connection and it is more resistant to degradation.
Designers of electric vehicle (EV) need large, powerful batterie while simultaneously maintaining weight to meet EV requirements. The plastic tray in Volfinity Cell Contacting System is relatively lightweight while delivering a reliable connection.
5G mmWave RF Flex-to-Board Connector offer excellent signal integrity (SI) performance for high-speed, Extreme RF application, along with the robust mating feature and PCB real-estate space saving needed in compact 5G mobile and other communication device.
Molex's proprietary contact-shielding and isolation of RF terminal preserve the highest level of SI performance needed for mission-critical 5G application, which includes ARs/VRs, Smart home device, Smartphones, Tablet PC, Wearable device, 5G and RF device, IoT, Portable audio and navigation equipment.
Molex has a wide array of product to meet design parameters. In addition, Molex is driving micro product into new markets, such as automotive and medical, which have many of these attribute and characteristic.
As application are being developed for smaller, higher performing technologie, Molex micro wire-to-board, wire-to-wire, board-to-board, FFC/FPC and memory card connector are being designed to meet these requirement, often times meaning higher performance in a smaller space.
Molex has the critical expertise to fulfill the promise of the future of automotive technology and connectivity. See all of the exciting way we're helping our customer and partner take the lead, including miniaturized system, wireles solution and advanced micro connector.
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